TechnoFusión: Difference between revisions

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== Plasma Wall Interaction ==
== Plasma Wall Interaction ==
Inside a future fusion reactor, some materials will not only be subjected to radiation, but also to enormous heat loads due to their direct contact with the plasma. In view of this, not only must stationary conditions of high density, low temperature and high power be reproduced, but also violent transient events (known as [[Edge Localized Modes|ELMs]] in plasma physics literature). Therefore, two plasma generation devices are planned: one is a linear plasma device, meant to reproduce the cited stationary conditions, and the other is a QSPA (Quasi-Stationary Plasma Accelerator) to simulate the transients. Both devices will be able to work with H, D, He and Ar.
Inside a fusion reactor, some materials will not be subjected only to radiation, but also to enormous heat loads in the case of plasma disruptions. In view of this, both: i) stationary conditions due to the intrinsic reactor properties: high density, low temperature and high power and ii) violent transient events (known as [[Edge Localized Modes|ELMs]] in plasma physics literature) must be reproduced. Therefore, it is essential to dispose of a device (which it will be called “plasma gun”) to study plasma-material interactions simultaneously in steady state and transient regimes, thereby allowing an analysis of the modification of the materials and their properties in fusion reactors.
The mentioned plasma gun would consist of two main elements: i) a linear plasma device capable of generating hydrogen plasmas with steady state particle fluxes of up to 1024 m-2s-1 (i.e., of the order of the expected ITER fluxes) and impact energies in the range of 1-10 eV, and ii) a device of the quasi-stationary plasma accelerators (QSPA) type, providing pulses lasting 0.1-1.0 ms and energy fluxes in the 0.1-20 MJm-2 range, in a longitudinal magnetic field of the order of 1 T or greater.
These devices are connected by a common vacuum chamber, allowing the exchange of samples, and their simultaneous or consecutive exposure to the steady state and transient plasma flows under controlled conditions. Both devices will operate with hydrogen, deuterium, helium, and argon.


== Liquid Metal Technology ==  
== Liquid Metal Technology ==  
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